【IC】多die设计的bump和TSV规划方法
https://www.synopsys.com/content/dam/synopsys/resources/multi-die/bump-tsv-planning-for-multi-die-designs-wp.pdf
https://www.synopsys.com/content/dam/synopsys/resources/multi-die/bump-tsv-planning-for-multi-die-designs-wp.pdf